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10-layer 1+N+1 HDI communication PCB
Name: 10-layer 1-stage HDI communication PCB
Layers: 1+8+1
Sheet: FR4 Tg170
Plate thickness: 1.2mm
Panel size: 110.8*94.8mm/4
Outer copper thickness: 35μm
Inner layer copper thickness: 18μm
Minimum through hole: 0.20mm
Minimum blind hole: 0.10mm
Minimum BGA: 0.20mm
Line width and line spacing: 2.5/2.2mil
Product Details
Technical Features
Impedance Specifications
· 50 Ω Antenna
· 90Ω & 100Ω Differential Impedance
Applications
Consumer Electronics
· Cell Phones
· Tablets
· Ultrabooks
· E-Readers
· MP3 Players
· GPS
· Portable Game Consoles
· DSCs (Digital Still Cameras)
· Cameras
· LCD TVs
· POS Terminals
Other Applications
HDI PCBs are widely used to reduce the weight and overall size of products, as well as improve the electrical performance of devices. High-density PCBs are often found in:
· Mobile phones
· Touch screen devices
· Laptops
· Digital cameras
· 4G network communications
Additionally, HDI PCB technology plays a crucial role in:
· Medical equipment
· Various electronic aircraft components
The possibilities for high-density interconnect PCB technology seem almost limitless, offering significant advantages in terms of size, weight, and electrical performance across a wide range of applications.
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