
10-layer 3+N+3 HDI PCB
Name: 10-layer 3-stage HDI PCB
Layers: 3+N+3
Sheet: FR4 Tg170
Plate thickness: 1.2mm
Panel size: 126*118mm/4
Outer copper thickness: 35μm
Inner layer copper thickness: 18μm
Minimum through hole: 0.20mm
Minimum blind hole: 0.10mm
Minimum BGA: 0.25mm
Line width and spacing: 2.8/3.2mil
Product Details
Technical Features and Applications of HDI PCBs
Impedance Specifications
· 50 Ω Antenna
· 90Ω & 100Ω Differential Impedance
Applications
Consumer Electronics
· Cell Phones
· Tablets
· Ultrabooks
· E-Readers
· MP3 Players
· GPS
· Portable Game Consoles
· DSCs (Digital Still Cameras)
· Cameras
· LCD TVs
· POS Terminals
High-Density Interconnect (HDI) PCB Usage
Mobile and Portable Devices
HDI PCBs are widely used to reduce the weight and overall size of products, as well as improve the electrical performance of devices. High-density PCBs are often found in:
· Mobile Phones
· Touch Screen Devices
· Laptops
· Digital Cameras
· 4G Network Communications
Other Applications
HDI PCB technology also plays an important role in:
· Medical Equipment
· Electronic Aircraft Components
The Future of HDI PCB Technology
The possibilities for high-density interconnect PCB technology seem almost limitless.
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