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Metal Etching Delicate Finishes IC Lead Frame
As the chip carrier for integrated circuits, lead frames are required in the vast majority of semiconductor blocks and are an important basic material in the electronic information industry. The integrated circuits lead frame maximizes chip performance, such as the heat-diffusing function, and enables it to be operated for long periods of time.
High Precision Etching IC Lead Frame is widely used in emerging products such as artificial intelligence, Internet of Things, smart manufacturing and new energy vehicles. The raw material use for IC Lead Frame are C192 or C194 Copper, which the material C192 has better conductivity. The production of smooth IC lead frames by metal etching process can achieve higher precision, for example, we can produce multi-pin (more than 100 pins) products of multi-pin IC lead frame, and can also produce ultra-thin products, such as etched 0.125mm thickness IC lead frame. Moreover, we can guarantee that our copper IC lead frame or half etching lead frame have uniform arrangement, straight etching line and smooth and delicate finishes.
Below are the specific parameters of this product, please check more IC LEAD FRAME in our website for more ideas.
Material
Thickness
Minimum Diameter
Minimum Distance
Accuracy
C192/C194 Copper
0.125mm - 0.25 mm
0.05 mm
0.18 mm - 0.3 mm
+- 0.02 mm —— +- 0.04 mm
Metal Etching IC Lead Frame
Metal Etching IC Lead Frame Detail
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Main Product:
Precision Machining,
Metal/Glass Etching ,
IC Lead Frame,
Semiconductor Package Carrier,
Precision Electroplating,
Precision Injection
