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Heavy Copper PCB
Model: Heavy Copper PCB
PCB Material: SY S1141
PCB Layer: 6Layers
Soldermask Color: Green
Silk Screen: White
Copper thickness: 2OZ/6OZ(70um)
Board Thickness: 2.8mmmm
Surface technology: Immersion Gold(1-3U)
Application: Power converter Heavy Copper PCB
Product Details
Heavy Copper PCB Overview
The Heavy Copper PCB is a specialized type of printed circuit board designed to handle high current applications. It features an increased copper thickness compared to standard PCBs, making it ideal for power-intensive electronics. Below is a detailed introduction to this advanced PCB technology.
Classification
Heavy Copper PCBs are primarily classified based on their copper thickness. Common classifications include 2OZ, 3OZ, 4OZ, up to 6OZ (or 70um and above). The model introduced here, Heavy Copper PCB, offers copper thicknesses of 2OZ and 6OZ, tailored to meet various high-power requirements.
Material Composition
The Heavy Copper PCB utilizes SY S1141 as its base material, a high-quality substrate known for its electrical and mechanical properties. The PCB is constructed with 6 layers, ensuring robust performance and reliability.
Performance Characteristics
Heavy Copper PCBs excel in handling high currents due to their thick copper layers. They also offer excellent thermal conductivity, which helps in dissipating heat efficiently. The surface technology used, Immersion Gold (1-3U), provides a protective coating that enhances corrosion resistance and improves solderability.
Structural Design
Structurally, the Heavy Copper PCB features a board thickness of 2.8mm, providing a sturdy base for components. The green soldermask color not only enhances visual appeal but also provides insulation and protection against environmental factors. The white silk screen adds to the board’s readability by clearly marking component locations and other essential information.
Distinctive Features
The defining feature of Heavy Copper PCBs is their ability to carry high currents without overheating or experiencing excessive voltage drop. This is achieved through the use of thick copper layers, which also contribute to the board’s overall durability. Additionally, the immersion gold surface finish ensures long-term reliability and ease of soldering.
Production Process
The production of Heavy Copper PCBs involves several precision steps:
1. Base Material Preparation: The SY S1141 substrate is prepared and cut to size.
2. Copper Lamination: Thick copper foil is laminated to the substrate using advanced bonding techniques.
3. Circuit Patterning: The desired circuit patterns are etched onto the copper foil.
4. Layer Stacking and Lamination: Multiple layers are stacked and laminated together to form the final PCB structure.
5. Drilling and Plating: Holes are drilled for component mounting and interconnection, followed by plating to enhance conductivity.
6. Soldermask Application: A green soldermask is applied to protect the circuits and provide insulation.
7. Silk Screen Printing: White silk screen ink is used to print component labels and other markings.
8. Surface Finish Application: The immersion gold coating is applied to the PCB surface.
9. Final Inspection and Testing: The PCB undergoes rigorous inspection and testing to ensure quality and performance.
Application Scenarios
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