AMB Ceramic Copper-clad Substrates For New Energy
AMB (Active Metal Brazing) ceramic copper-clad substrates are made based on the DBC (Direct Bond Copper) technology. When the temperature is as high as around 800 °C, AgCu solders that have active elements like Ti and Zr in them will get wet and react at the place where the ceramic and the metal meet. In this way, the ceramic and the metal can be bonded together even though they are different materials.
Performance Advantages
High Thermal Conductivity: For example, the thermal conductivity of the Si₃N₄-AMB substrate is greater than 90 W/mK, which can quickly conduct heat away and effectively solve the heat dissipation problem of high-power devices.
High Bonding Strength: The bonding is achieved through the chemical reaction between the ceramic and the active metal paste at high temperatures. It has a higher bonding strength, and the copper foil is not easy to fall off during use, which can improve the reliability and stability of the product.
Good Match of Coefficient of Thermal Expansion: Silicon nitride ceramics have a relatively small coefficient of thermal expansion, which is close to that of semiconductor chip materials such as SiC crystals. It can match the chip materials more stably, reducing thermal stress and deformation caused by the difference in the coefficient of thermal expansion, and improving the reliability and service life of the packaging.
High Current-Carrying Capacity: Very thick copper metal can be welded onto relatively thin ceramics. For example, the thickness of the copper foil can reach 0.8 mm. Therefore, it has a high current-carrying capacity and can meet the conductive requirements in high-power and large-current scenarios.
Excellent Thermal and Cold Shock Performance: It has a relatively high cycle life under high and low temperature cycling shocks. For example, under the thermal and cold shock test (-55 - 150 °C, staying at high and low temperatures for 15 minutes respectively, and the transition time < 30 s), the cycle life of the Si₃N₄-AMB substrate can reach more than 5,000 times, and it can adapt to complex and changeable working environments.
Preparation Process
First, the active metal solder is coated on the surface of the ceramic substrate by screen printing or other methods. Then, the oxygen-free copper foil is placed on the solder. After that, it is put into a vacuum brazing furnace for high-temperature sintering to make the solder melt and react with the ceramic and the copper foil, realizing the firm bonding between the copper foil and the ceramic. Finally, the required circuit patterns are fabricated on the copper foil through etching and other processes.
Application Fields
New Energy Vehicles: With the development of new energy vehicles, especially the popularization of the 800V high-voltage architecture, the "SiC + AMB" technological route has become an industry trend. AMB ceramic copper-clad substrates can be used for the packaging of power devices in automotive electric drive systems, such as IGBT and silicon carbide power modules, to meet their requirements for high reliability, heat dissipation, and partial discharge.
Rail Transit: In the inverter systems and other equipment of rail transit, AMB ceramic copper-clad substrates can withstand high voltage, large current, and frequent thermal and cold shocks, providing good heat dissipation and electrical insulation properties for power devices and ensuring the stable operation of the equipment.
Wind-Solar-Storage: In wind power generation, photovoltaic power generation, and energy storage systems, they can be used for the packaging of power devices in power conversion and control circuits, such as inverters and converters. Their characteristics of high thermal conductivity, high current-carrying capacity, and high reliability contribute to improving the efficiency and stability of the systems.
Hydrogen Energy: In fuel cell systems and other equipment in the hydrogen energy field, AMB ceramic copper-clad substrates can be used as key packaging materials to provide reliable support for power control and conversion.
We offer a variety of advanced ceramics, including alumina ceramics, aluminum nitride ceramics, silicon carbide ceramics, silicon nitride ceramics, and ceramic metallization materials, to improve and expand the performance of your products, processes, or systems. Whether you need high temperature stability, high hardness and wear-resistant surface, increased stiffness to resist weight radiation, anti-corrosion barrier or low thermal expansion rate, we can provide them. We can provide significant performance and cost advantages to meet your needs.
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