Our optical communication device housings are specifically designed to meet the requirements of providing an electrical signal transmission channel and an optical coupling interface. They are designed to offer mechanical support and gas-tight protection while solving the interconnection challenges between the chip and external circuitry. These housings are capable of accommodating a 50 Ohm characteristic impedance transmission connector, making them suitable for various transmission rates including 2.5Gbps, 10Gbps, 25Gbps, 40Gbps, and 100Gbps.
We offer a wide range of products within this category, including the 14-lead butterfly housing, 10-100Gbps transmission TOSA housing, 10Gbps/100Gbps transmission receiver housing, Mini-Pin structure housing, Mini-Dil structure housing, and high-power laser housing series. These housings are designed to package various types of optical transmitting and receiving devices, as well as optical switches, fiber optic communication devices, and high-power lasers.
Our optical communication device housings find applications in broadband access, transmission networks, data communication, and CATV. With their metal wall - ceramic insulator structure, they provide an excellent combination of electrical signal transmission and optical coupling capabilities, while ensuring mechanical support and gas-tight protection.
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Tungsten Heavy Alloys,
Heat Sink,
Electronic Packaging,
Rhenium Alloys ,
Tantalum Alloys,
Nickel Based Braze Alloy