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Highly active microsilica for copper clad plate:This type of highly active microsilica powder is commonly used in electronics.Adding silicon micropowder to copper-clad laminates can improve the physical properties of printed circuit boards such as linear expansion coefficient and thermal conductivity, thus effectively improving the reliability and heat dissipation of electronic products. Currently applied to the copper-cladding board of silicon micropowder are mainly crystalline silicon micropowder, fused (amorphous) silicon micropowder, spherical silicon micropowder, composite silicon micropowder, active silicon micropowder and other five varieties. Spherical silica micropowder is mainly used in highly filled and reliable high-performance copper-clad laminates due to its unique features of high filling, good fluidity and excellent dielectric properties. The main indicators of concern for spherical silica micropowder for copper-clad laminates are: particle size distribution, sphericity, purity (conductivity, magnetic substances and black spots). At present, spherical silica micropowder is mainly used in rigid copper-clad laminates, accounting for the mixing ratio of copper-clad laminates is generally 20% to 30%; flexible copper-clad laminates and paper-based copper-clad laminates are used in a relatively small amount.Silica fume.
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Main Product:
Microsilica ,
Silica Fume,
Blank Silica Fume,
Gray Silica Fume,
Semi-encrypted Silica Fume,
Zirconium Silicon Fume
