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The thermal conductivity of Fumed silica vacuum insulation panels is about 0.0045 W/(m•K) after production. By comparison, thermal conductivity of conventional insulation materials is typically between 0.030 and 0.040 W/(m•K).
Vacuum Insulation Technology provides:
Extremely low insulation thicknesses (10 mm to 25 mm), increasing the volume capacity of applications where lack of space for insulation layer thickness is an issue. Moreover, the performance of lowest heat conductivity material VIP is stable and long-term thermal when panels are installed correctly and protected from damage and penetration.
High-performance Small thermal bridge insulation VIP panels have a thermal conductivity 8 to 10 times lower than other conventional insulation materials (35 mW/(m•K). This low conductivity materials fumed silica VIP helps many industries realize a improvement. In addition, it is possible for VIP to have a new design and construction by coating with other materials for surface protection.
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Main Product:
Microporous insulation board,
Refractory nano board,
Silica insulation material,
Fumed silica vacuum insulation panel,
Fiberglass core vacuum insulation panel ,
Special building insulation material
